The base material of the mobile phone motherboard is PCB board, and the material is double-sided glass fiber board.
PCB boards are divided into several quality levels.
1, from the bottom to the height of the division is as follows: 94HB-94VO-22F-CEM-1-CEM-3-FR-4 (this is the mobile phone motherboard material).
2, the detailed parameters and uses are as follows: 94HB: ordinary cardboard, not fireproof (the lowest grade material, die punching, can not be a power board); 94V0: flame retardant cardboard (die punching); 22F: single-sided semi-glass fiber board (die punching); Cim-1: single glass fiber board (must be computer drilling, can not die punching); Cim-3: double-sided half-glass fiber board (in addition to double-sided cardboard is the lowest end of the double-panel material, simple double-panel can use this material, than FR-4 will be cheaper 5~10 yuan\/square meter); FR-4: Double-sided glass fiber board (this is the mobile phone motherboard material).